INTEGRATED CIRCUIT PACKAGING SYSTEM WITH NO-REFLOW CONNECTION AND METHOD OF MANUFACTURE THEREOF

1 . A method of manufacture of an integrated circuit packaging system comprising:

providing an integrated circuit;

providing a substrate having a substrate contact;

forming an internal interconnect between the substrate and the integrated circuit, the internal interconnect is a no-reflow connection directly on the substrate contact and the integrated circuit; and

forming an encapsulation over the internal interconnect.

2 . The method as claimed in claim 1 wherein forming the internal interconnect includes forming the internal interconnect directly on a substrate contact top side of the substrate contact and a device connector of the integrated circuit.

3 . The method as claimed in claim 1 wherein forming the internal interconnect includes forming the internal interconnect only directly on a substrate contact top side of the substrate contact and a device connector of the integrated circuit.

4 . The method as claimed in claim 1 wherein forming the internal interconnect includes forming the internal interconnect vertically elongated.

5 . The method as claimed in claim 1 further comprising forming an underfill between the substrate and the integrated circuit.

6 . A method of manufacture of an integrated circuit packaging system comprising:

providing an integrated circuit;

providing a substrate having a substrate contact;

forming an internal interconnect between the substrate and the integrated circuit, the internal interconnect is a no-reflow connection directly on the substrate contact and the integrated circuit; and

forming an encapsulation over the internal interconnect and the substrate.

7 . The method as claimed in claim 6 wherein forming the internal interconnect includes forming the internal interconnect directly on a contact non-horizontal side of the substrate contact, a substrate contact top side of the substrate contact, and a device connector of the integrated circuit.

8 . The method as claimed in claim 6 wherein forming the internal interconnect includes forming the internal interconnect only directly on a substrate contact top side of the substrate contact and a device connector of the integrated circuit, wherein the substrate contact is completely within the substrate.

9 . The method as claimed in claim 6 wherein forming the internal interconnect includes forming the internal interconnect vertically elongated and directly on the substrate contact and an active side of the integrated circuit, the internal interconnect having a concave non-horizontal surface.

10 . The method as claimed in claim 6 further comprising forming an underfill between the substrate and the integrated circuit, the underfill covering the internal interconnect.

11 . An integrated circuit packaging system comprising:

an integrated circuit;

a substrate having a substrate contact;

an internal interconnect between the substrate and the integrated circuit, the internal interconnect is a no-reflow connection directly on the substrate contact and the integrated circuit; and

an encapsulation over the internal interconnect.

12 . The system as claimed in claim 11 wherein the internal interconnect is directly on a substrate contact top side of the substrate contact and a device connector of the integrated circuit.

13 . The system as claimed in claim 11 wherein the internal interconnect is only directly on a substrate contact top side of the substrate contact and a device connector of the integrated circuit.

14 . The system as claimed in claim 11 wherein the internal interconnect is vertically elongated.

15 . The system as claimed in claim 11 further comprising an underfill between the substrate and the integrated circuit.

16 . The system as claimed in claim 11 wherein the encapsulation is over the substrate.

17 . The system as claimed in claim 16 wherein the internal interconnect is directly on a contact non-horizontal side of the substrate contact, a substrate contact top side of the substrate contact, and a device connector of the integrated circuit.

18 . The system as claimed in claim 16 wherein the internal interconnect is only directly on a substrate contact top side of the substrate contact and a device connector of the integrated circuit, wherein the substrate contact is completely within the substrate.

19 . The system as claimed in claim 16 wherein the internal interconnect is vertically elongated and directly on the substrate contact and an active side of the integrated circuit, the internal interconnect having a concave non-horizontal surface.

20 . The system as claimed in claim 16 further comprising an underfill between the substrate and the integrated circuit, the underfill covering the internal interconnect.