Patent Assignment
Reel/Frame 035649/0792
Assignment of Assignor's Interest
Recorded: 2015-05-15
Pages: 6
Assignors
KIM, KYUNGOE
Executed: 2015-04-27
PARK, SEONG WON
Executed: 2015-05-15
KIM, MINJUNG
Executed: 2015-04-27
KIM, CHANGHWAN
Executed: 2015-05-11
KWAK, BYUNGHYUN
Executed: 2015-05-06
LEE, WANIL
Executed: 2015-05-11
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Properties
(2)
Integrated Circuit Packaging System with No-Reflow Connection and Method of Manufacture Thereof
Application:
14/696,741 →
Publication:
US 2015/0318259
Integrated Circuit Packaging System with No-Reflow Solder Connection and Method of Manufacture Thereof
Application:
61/987,708 →
Related Assignments
(1)
Other recorded transfers of the patents in this record — the chain of ownership.