Patent Application
Provisional
App. No. 61/987,708
· Confirmation No. 7667
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH NO-REFLOW SOLDER CONNECTION AND METHOD OF MANUFACTURE THEREOF
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2015-04-27 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2015-04-23 | PD.TO.AUTH |
Authorization or Rescission of Authorization to Access Application by Digital Access Service /Priority Document Exchange Office | 2 | View | |
| 2015-04-23 | N417 |
Electronic Filing System Acknowledgment Receipt | 2 | View | |
| 2014-05-21 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2014-05-14 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2014-05-02 | TR.PROV |
Provisional Cover Sheet (SB16) | 4 | View | |
| 2014-05-02 | SPEC |
Specification | 8 | View | |
| 2014-05-02 | CLM |
Claims | 1 | View | |
| 2014-05-02 | ABST |
Abstract | 1 | View | |
| 2014-05-02 | DRW |
Drawings-only black and white line drawings | 4 | View | |
| 2014-05-02 | WFEE |
Fee Worksheet (SB06) | 2 | View | |
| 2014-05-02 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View |
Inventors
KyungOe Kim
Daejeon, KOREA, REPUBLIC OF
Seong Won Park
Icheon-si, KOREA, REPUBLIC OF
MinJung Kim
Kwang-ju-city, KOREA, REPUBLIC OF
ChangHwan Kim
Cheonan-si, KOREA, REPUBLIC OF
ByungHyun Kwak
Icheon-si, KOREA, REPUBLIC OF
WanIl Lee
Seoul, KOREA, REPUBLIC OF
Attorneys & Agents of Record
Prosecution
- Customer No.
- 22898
- Docket No.
- 27-918P
- Confirmation No.
- 7667
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2015-05-15
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Quick Facts
- App. No.
- 61/987,708
- Filed
- 2014-05-02
External Links