INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE MECHANISM AND METHOD OF MANUFACTURE THEREOF

1 . A method of manufacture of an integrated circuit packaging system comprising:

depositing an upper connection joint on an interposer;

attaching a metal core interconnect to the upper connection joint; and

attaching the metal core interconnect and the interposer to a substrate.

2 . The method as claimed in claim 1 further comprising mounting an integrated circuit die to the substrate.

3 . The method as claimed in claim 1 further comprising heating the metal core interconnect, the interposer, and the upper connection joint for reflowing the upper connection joint.

4 . The method as claimed in claim 1 further comprising:

depositing a lower connection joint on the substrate; and

attaching the metal core interconnect and the interposer to the lower connection joint.

5 . The method as claimed in claim 1 wherein attaching the metal core interconnect includes attaching a solid metal core covered in an anti-oxide layer.

6 . A method of manufacture of an integrated circuit packaging system comprising:

depositing an upper connection joint on an interposer;

attaching a metal core interconnect to the upper connection joint;

heating the metal core interconnect, the interposer, and the upper connection joint for reflowing the upper connection joint;

mounting an integrated circuit die to a substrate; and

attaching the metal core interconnect and the interposer to the substrate.

7 . The method as claimed in claim 6 further comprising heating the metal core interconnect, the lower connection joint, the upper connection joint, the interposer, and the substrate for reflowing the lower connection joint.

8 . The method as claimed in claim 6 wherein depositing the upper connection joint includes depositing a solder paste.

9 . The method as claimed in claim 6 wherein depositing the upper connection joint includes depositing an anisotropic conductive paste.

10 . The method as claimed in claim 6 wherein depositing the upper connection joint includes depositing an anisotropic conductive film.

11 . An integrated circuit packaging system comprising:

a substrate;

a metal core interconnect attached to the substrate;

an upper connection joint attached above and to the metal core interconnect; and

an interposer attached to the upper connection joint.

12 . The system as claimed in claim 11 further comprising an integrated circuit die mounted on the substrate.

13 . The system as claimed in claim 11 further comprising:

an integrated circuit die mounted on the substrate; and

an interposer adhesive on and between the integrated circuit die and the interposer.

14 . The system as claimed in claim 11 further comprising a lower connection joint between and on the substrate and the metal core interconnect.

15 . The system as claimed in claim 11 wherein the metal core interconnect includes a solid metal core covered in an anti-oxide layer.

16 . The system as claimed in claim 11 further comprising:

an integrated circuit die mounted on the substrate;

an interposer adhesive on and between the integrated circuit die and the interposer; and

a lower connection joint between and on the substrate and the metal core interconnect.

17 . The system as claimed in claim 16 wherein the metal core interconnect includes a solid copper or copper alloy core.

18 . The system as claimed in claim 16 wherein the upper connection joint is a solder paste.

19 . The system as claimed in claim 16 wherein the upper connection joint is an anisotropic conductive paste.

20 . The system as claimed in claim 16 wherein the upper connection joint is an anisotropic conductive film.