Assignment of Assignor's Interest

Recorded: 2015-12-28 Pages: 5

Assignors

PARK, SOOSAN

Executed: 2015-12-21

CHI, HEEJO

Executed: 2015-12-21

DO, BYUNG TAI

Executed: 2015-12-21

Assignee

STATS CHIPPAC LTD.

10 ANG MO KIO STREET 65, #04-08/09 TECHPOINT, SINGAPORE, 569059, SINGAPORE

Covered Properties (2)

Integrated Circuit Packaging System with Package-on-Package Mechanism and Method of Manufacture Thereof

Application: 14/980,292 →

Publication: US 2016/0190056

Integrated Circuit Packaging System with Package-on-Package Mechanism and Method of Manufacture Thereof

Application: 62/097,248 →

Related Assignments (1)

Other recorded transfers of the patents in this record — the chain of ownership.