INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PADS AND METHOD OF MANUFACTURE THEREOF

1 . A method of manufacture of an integrated circuit packaging system comprising:

forming a circuit structure having a circuit active side and a cavity from the circuit active side;

mounting an integrated circuit device in the cavity;

forming a base encapsulation, having a base first side facing away from the circuit active side, on the circuit active side, around the integrated circuit device, and in the cavity;

forming a first conductive pin, having a first pin height, in the base encapsulation and traversing from the circuit active side to the base first side;

forming a second conductive pin, having a second pin height equivalent to the first pin height, in the base encapsulation and traversing from the integrated circuit device to the base first side; and

removing a portion of the circuit structure to form a circuit non-active side and expose the integrated circuit device and a base second side, the base second side opposite the base first side.

2 . The method as claimed in claim 1 further comprising forming a through pin, adjacent to the circuit structure, in the base encapsulation and traversing from the base first side to the base second side.

3 . The method as claimed in claim 1 wherein forming the circuit structure includes forming a conductive via, in the circuit structure, traversing from the circuit active side to the circuit non-active side.

4 . The method as claimed in claim 1 wherein removing the portion of the circuit structure includes forming a through hole traversing from the circuit active side and the circuit non-active side.

5 . The method as claimed in claim 1 further comprising mounting a mountable device on the base first side of the base encapsulation.

6 . A method of manufacture of an integrated circuit packaging system comprising:

forming a circuit structure having a circuit active side and a cavity from the circuit active side;

mounting an integrated circuit device, having a device active side, in the cavity;

forming a base encapsulation, having a base first side facing away from the circuit active side and a base second side opposite the base first side, on the circuit active side, around the integrated circuit device, and in the cavity;

forming a first conductive pin, having a first pin height, in the base encapsulation traversing from the circuit active side to and co-planar with the base first side;

forming a second conductive pin, having a second pin height equivalent to the first pin height, in the base encapsulation traversing from the device active side to and co-planar with the base first side; and

removing a portion of the circuit structure to form a circuit non-active side, a device non-active side of the integrated circuit device, and expose a base second side.

7 . The method as claimed in claim 6 wherein forming the first conductive pin includes connecting the first conductive pin with a conductive via in the circuit structure.

8 . The method as claimed in claim 6 further comprising:

mounting an internal integrated circuit on the device active side of the integrated circuit device; and

wherein forming the base encapsulation includes covering the internal integrated circuit.

9 . The method as claimed in claim 6 further comprising mounting a component device on the circuit active side of the circuit structure.

10 . The method as claimed in claim 6 wherein the circuit non-active side and the device non-active side are exposed from the base encapsulation and co-planar with the base second side.

11 . An integrated circuit packaging system comprising:

a circuit structure having a through hole, a circuit active side, and a circuit non-active side with the through hole traversing from the circuit active side to the circuit non-active side;

an integrated circuit device in the through hole;

a base encapsulation, having a base first side facing away from the circuit active side and a base second side opposite the base first side, on the circuit active side, around the integrated circuit device, and in the through hole;

a first conductive pin, having a first pin height, in the base encapsulation and traversing from the circuit active side to the base first side; and

a second conductive pin, having a second pin height equivalent to the first pin height, in the base encapsulation and traversing from the integrated circuit device to the base first side.

12 . The system as claimed in claim 11 further comprising a through pin, adjacent to the circuit structure, in the base encapsulation and traversing from the base first side to the base second side.

13 . The system as claimed in claim 11 further comprising a conductive via in the circuit structure and traversing from the circuit active side to the circuit non-active side.

14 . The system as claimed in claim 11 further comprising a conductive trace connecting the first conductive pin and the second conductive pin.

15 . The system as claimed in claim 11 further comprising a mountable device on the base first side of the base encapsulation.

16 . The system as claimed in claim 11 wherein:

the integrated circuit device includes a device active side and a device non-active side;

and the second conductive pin traverses from the device active side to the base first side.

17 . The system as claimed in claim 16 wherein the first conductive pin is connected with a conductive via in the circuit structure.

18 . The system as claimed in claim 16 further comprising:

an internal integrated circuit on the device active side of the integrated circuit device; and

wherein the base encapsulation covers the internal integrated circuit.

19 . The system as claimed in claim 16 further comprising a component device on the circuit active side of the circuit structure.

20 . The system as claimed in claim 16 wherein the circuit non-active side and the device non-active side are exposed from the base encapsulation and co-planar with the base second side.