Large die package structures and fabrication method therefor
View Patent ↗A method for fabricating large die package structures is provided wherein at least portions of the leadtips of at least a plurality of leadfingers of a leadframe are electrically insulated. A die is positioned on the electrically insulated leadtips. The die is electrically connected to at least a plurality of the leadfingers.
1. A method for fabricating large die package structures, comprising:
providing a leadframe having a plurality of leadfingers;
electrically insulating at least portions of the leadtips of at least a plurality of leadfingers of the leadframe;
forming notches in at least a plurality of the leadtips;
positioning a die in the notches on the electrically insulated leadtips;
electrically connecting the die to at least some of the plurality of leadfingers; and
encapsulating at least a portion of the leadframe and die in a mold compound.
2. The method of claim 1 wherein electrically insulating further comprises insulating with a non-conductive material located between the leadtips and the die.
3. The method of claim 1 wherein forming notches further comprises forming notches in the upper surfaces of the leadtips for receiving the die therein.
4. The method of claim 1 wherein positioning the die further comprises supporting the die on a flip chip that is located on the leadframe and electrically connected thereto.
5. A large die package structure, comprising:
a leadframe having leadfingers;
leadtips on the leadfingers;
at least portions of the leadtips of at least some of the plurality of leadfingers being electrically insulated;
notches in at least a plurality of the leadtips;
a die positioned in the notches on the electrically insulated leadtips;
the die being electrically connected to at least some of the plurality of leadfingers; and
a mold compound encapsulating at least a portion of the leadframe and the die.
6. The structure of claim 5 wherein the leadfingers are electrically insulated with a non-conductive material located between the leadtips and the die.
7. The structure of claim 5 wherein the notches further comprise notches in the upper surfaces of the leadtips for receiving the die therein.
8. The structure of claim 5 :
further comprising a flip chip that is located on the leadframe and electrically connected thereto; and
wherein the die is supported on the flip chip.
9. A large die package structure, comprising:
a leadframe having leadfingers;
leadtips on the leadfingers;
the leadtips of the leadfingers being electrically insulated;
notches in the leadtips configured for receiving a die in the notches;
a die positioned in the notches on the electrically insulated leadtips;
wirebonds electrically connecting the die to the leadfingers; and
a mold compound encapsulating at least a portion of the leadframe and the die.
10. The structure of claim 9 wherein the leadfingers are electrically insulated with a non-conductive material located between the leadtips and the die.
11. The structure of claim 9 wherein the notches further comprise notches in the upper surfaces of the leadtips for receiving the die therein.
12. The structure of claim 9 :
further comprising a flip chip that is located on the leadframe and electrically connected thereto; and
wherein the die is supported on the flip chip.