Semiconductor device and method of forming supporting layer over semiconductor die in thin fan-out wafer level chip scale package
A semiconductor device includes a semiconductor die. An encapsulant is formed around the semiconductor die. A build-up interconnect structure is formed over a first surface of the semiconductor die and encapsulant. A first supporting layer is formed over a second surface of the semiconductor die as a supporting substrate or silicon wafer disposed opposite the build-up interconnect structure. A second supporting layer is formed over the first supporting layer and includes a fiber enhanced polymer composite material comprising a footprint including an area greater than or equal to an area of a footprint of the semiconductor die. The semiconductor die comprises a thickness less than 450 micrometers (μm). The thickness of the semiconductor die is at least 1 μm less than a difference between a total thickness of the semiconductor device and a thickness of the build-up interconnect structure and the second supporting layer.
1. A method of making a semiconductor device, comprising:
providing a carrier;
disposing a first supporting layer over the carrier with an opening in the first supporting layer;
disposing a semiconductor die over the carrier within the opening of the first supporting layer, wherein a width of the opening is greater than a width of the semiconductor die leaving a gap between a side surface of the semiconductor die and a side surface of the first supporting layer, and wherein a height of the semiconductor die is greater than a height of the first supporting layer;
depositing an encapsulant over the semiconductor die and in the gap between the semiconductor die and first supporting layer to contact the side surface of the semiconductor die and the side surface of the first supporting layer; and
removing the carrier after depositing the encapsulant.
2. The method of claim 1 , further including:
disposing the semiconductor die over the carrier with an active surface of the semiconductor die oriented toward the carrier; and
forming an interconnect structure over the active surface of the semiconductor die and a first surface of the encapsulant after removing the carrier.
3. The method of claim 2 , further including forming a second supporting layer over a second surface of the encapsulant opposite the first surface of the encapsulant.
4. The method of claim 1 , wherein the first supporting layer includes a fiber enhanced polymer matrix composite material.
5. The method of claim 1 , further including removing a portion of the encapsulant.
6. The method of claim 1 , wherein removing the carrier exposes the first supporting layer and semiconductor die.
7. The method of claim 1 , further including disposing the semiconductor die over the carrier with an active surface of the semiconductor die oriented toward the carrier.
8. A method of making a semiconductor device, comprising:
providing a semiconductor die;
disposing a first supporting layer in a peripheral region around the semiconductor die to leave a gap between a side surface of the semiconductor die and a side surface of the first supporting layer, wherein a height of the first supporting layer is less than a height of the semiconductor die; and
depositing an encapsulant over the semiconductor die and in the gap between the semiconductor die and first supporting layer to contact the side surface of the semiconductor die and the side surface of the first supporting layer.
9. The method of claim 8 , further including forming an interconnect structure over the semiconductor die and a first surface of the encapsulant.
10. The method of claim 9 , further including forming a second supporting layer over a second surface of the encapsulant opposite the first surface of the encapsulant.
11. The method of claim 10 , wherein the second supporting layer includes a polymer dielectric film.
12. The method of claim 8 , wherein the first supporting layer includes a fiber enhanced polymer matrix composite material.
13. The method of claim 8 , further including removing a portion of the encapsulant.
14. A semiconductor device, comprising:
a first supporting layer;
a semiconductor die disposed within an opening of the first supporting layer, wherein a width of the opening is greater than a width of the semiconductor die with a gap between a side surface of the semiconductor die and a side surface of the first supporting layer, and wherein a height of the first supporting layer is less than a height of the semiconductor die; and
an encapsulant deposited over the semiconductor die and in the gap between the semiconductor die and first supporting layer to contact the side surface of the semiconductor die and the side surface of the first supporting layer.
15. The semiconductor device of claim 14 , further including an interconnect structure formed over the semiconductor die and a first surface of the encapsulant.
16. The semiconductor device of claim 15 , further including a second supporting layer formed over a second surface of the encapsulant opposite the first surface of the encapsulant.
17. The semiconductor device of claim 16 , wherein the second supporting layer includes a polymer dielectric film.
18. The semiconductor device of claim 15 , wherein the first supporting layer includes a fiber enhanced polymer matrix composite material.
19. A semiconductor device comprising:
a semiconductor die;
a first supporting layer disposed in a peripheral region around the semiconductor die to leave a gap between a side surface of the semiconductor die and a side surface of the first supporting layer, wherein a height of the first supporting layer is less than a height of the semiconductor die; and
an encapsulant deposited over the semiconductor die and in the gap between the semiconductor die and first supporting layer to contact the side surface of the semiconductor die and the side surface of the first supporting layer.
20. The semiconductor device of claim 19 , further including an interconnect structure formed over the semiconductor die and a first surface of the encapsulant.
21. The semiconductor device of claim 20 , further including a second supporting layer formed over a second surface of the encapsulant opposite the first surface of the encapsulant.
22. The semiconductor device of claim 21 , wherein the second supporting layer includes a polymer dielectric film.
23. The semiconductor device of claim 19 , wherein the first supporting layer includes a fiber enhanced polymer matrix composite material.