Patent Assignment
Reel/Frame 036626/0664
Assignment of Assignor's Interest
Recorded: 2015-09-22
Pages: 3
Assignors
BOSAK, HENRY C.
Executed: 2015-09-21
KOFSTAD, HARVEY R.
Executed: 2015-09-19
BOYD, THOMAS A.
Executed: 2015-09-19
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Automatic Height Compensating and Co-Planar Leveling Heat Removal Assembly for Multi-Chip Packages