Patent Assignment
Reel/Frame 036627/0152
Assignment of Assignor's Interest
Recorded: 2015-09-22
Pages: 6
Assignors
HAMAYA, TAKASHI
Executed: 2015-05-14
TSUGANE, HIDEAKI
Executed: 2015-04-17
SUZUKI, HIDENORI
Executed: 2015-04-22
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device and Sputtering Apparatus