Patent Assignment
Reel/Frame 036627/0686
Assignment of Assignor's Interest
Recorded: 2015-09-23
Pages: 10
Assignors
HUNG, CHING-WEN
Executed: 2015-09-16
HUANG, CHIH-SEN
Executed: 2015-09-16
CHEN, YI-WEI
Executed: 2015-09-16
TZOU, SHIH-FANG
Executed: 2015-09-16
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Method for Forming Semiconductor Device