Patent Assignment
Reel/Frame 036632/0591
Assignment of Assignor's Interest
Recorded: 2015-09-23
Pages: 3
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI-SHI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Printed Wiring Board and Method for Manufacturing the Same