IP Library Assignment 036638/0934
Patent Assignment
Reel/Frame 036638/0934

Assignment of Assignor's Interest

Recorded: 2015-09-23 Pages: 3
Assignor
FONTANA, FULVIO
Executed: 2015-09-17
Assignee
STMICROELECTRONICS S.R.L.
VIA C. OLIVETTI, 2, AGRATE BRIANZA, 20864, ITALY
Covered Property (1)
Package for Semiconductor Devices Sensitive to Mechanical and Thermo-Mechanical Stresses, Such as Mems Pressure Sensors
Patent: 9,841,341 →
Application: 14/861,648 →
Publication: US 2016/0146692
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 23, 2015
From: TALLEDO, JEFFERSON
To: STMICROELECTRONICS, INC.
Reel/Frame 036638/0942 →
Assignment of Assignor's Interest Nov 1, 2022
From: STMICROELECTRONICS, INC.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 061608/0550 →
Assignment of Assignor's Interest Nov 1, 2022
From: STMICROELECTRONICS S.R.L.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 061828/0243 →