Patent Assignment
Reel/Frame 061608/0550
Assignment of Assignor's Interest
Recorded: 2022-11-01
Pages: 11
Assignor
STMICROELECTRONICS, INC.
Executed: 2022-10-26
Assignee
STMICROELECTRONICS INTERNATIONAL N.V.
CHEMIN DU CHAMP-DES-FILLES 39, 1228 PLAN-LES-OUATES, GENEVA, SWITZERLAND
Covered Properties
(27)
Leadless Packages and Method of Manufacturing Same
Method for Making Semiconductor Device with Lead Frame Made from Top and Bottom Components and Related Devices
Semiconductor Device with Encapsulated Lead Frame Contact Area and Related Methods
Support Structure for Stacked Integrated Circuit Dies
Semiconductor Device with Lead Frame Contact Solder Balls and Related Methods
Patent:
9,165,867 →
Application:
14/449,492 →
Integrated Circuit Device Having Exposed Contact Pads and Leads Supporting the Integrated Circuit Die and Method of Forming the Device
Patent:
9,324,643 →
Application:
14/566,826 →
Semiconductor Package with Cantilever Pads
Semiconductor Device with Sloped Sidewall and Related Methods
Semiconductor Device Including Conductive Clip with Flexible Leads and Related Methods
Semiconductor Packages Separated Using a Sacrificial Material
Leadframe Package with Stable Extended Leads
Package for Semiconductor Devices Sensitive to Mechanical and Thermo-Mechanical Stresses, Such as Mems Pressure Sensors
Semiconductor Package with Integrated Heatsink
Electronic Package Having Electromagnetic Interference Shielding and Associated Method
Method for Making a Shielded Integrated Circuit (Ic) Package with an Electrically Conductive Polymer Layer
Stacked Semiconductor Package with Compliant Corners on Folded Substrate
Tapeless Leadframe Package with Underside Resin and Solder Contact
Die with Metallized Sidewall and Method of Manufacturing
Flow Over Wire Die Attach Film and Conductive Molding Compound to Provide an Electromagnetic Interference Shield for a Semiconductor Die
Patent:
9,953,933 →
Application:
15/474,904 →
Package with Backside Protective Layer During Molding to Prevent Mold Flashing Failure
Qfn Pre-Molded Leadframe Having a Solder Wettable Sidewall on Each Lead
Patent:
10,079,198 →
Application:
15/610,088 →
Leadframe Package with Stable Extended Leads
Manufacturing Method for Semiconductor Package with Cantilever Pads
Qfn Pre-Molded Leadframe Having a Solder Wettable Sidewall on Each Lead
Tapeless Leadframe Package with Underside Resin and Solder Contact
Leadframe having a Conductive Layer Protruding through a Lead Recess
Qfn Pre-Molded Leadframe Having a Solder Wettable Sidewall on Each Lead
Related Assignments
(20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 29, 2013
From: JAURIGUE, JONATHAN; REAL, ROGELIO; LLANA, FRANCIS ANN; CALUSTRE, RICKY
To: STMICROELECTRONICS, INC.
Reel/Frame 031110/0522 →
Assignment of Assignor's Interest
Jun 5, 2014
From: SEGUIDO, RAMMIL; GOMEZ, FREDERICK RAY; ANGELES, EMMANUEL
To: STMICROELECTRONICS, INC.
Reel/Frame 033040/0897 →
Assignment of Assignor's Interest
Jun 9, 2014
From: TALLEDO, JEFFERSON
To: STMICROELECTRONICS, INC.
Reel/Frame 033105/0683 →
Assignment of Assignor's Interest
Jun 9, 2014
From: TALLEDO, JEFFERSON
To: STMICROELECTRONICS, INC.
Reel/Frame 033105/0774 →
Assignment of Assignor's Interest
Aug 6, 2014
From: CADAG, ELA MIA; TALLEDO, JEFFERSON
To: STMICROELECTRONICS, INC.
Reel/Frame 033473/0629 →
Assignment of Assignor's Interest
Dec 23, 2014
From: CADAG, ELA MIA; CALUSTRE, RICKY
To: STMICROELECTRONICS, INC.
Reel/Frame 034573/0266 →
Assignment of Assignor's Interest
Jan 26, 2015
From: TALLEDO, JEFFERSON; DIMAYUGA, GODFREY
To: STMICROELECTRONICS, INC.
Reel/Frame 034813/0555 →
Assignment of Assignor's Interest
Mar 31, 2015
From: TALLEDO, JEFFERSON; CADAG, ELA MIA
To: STMICROELECTRONICS, INC.
Reel/Frame 035304/0077 →
Assignment of Assignor's Interest
Mar 31, 2015
From: DIMAYUGA, GODFREY; TALLEDO, JEFFERSON
To: STMICROELECTRONICS, INC.
Reel/Frame 035304/0019 →
Assignment of Assignor's Interest
Jun 30, 2015
From: TALLEDO, JEFFERSON; ZAPANTA, AMOR
To: STMICROELECTRONICS, INC.
Reel/Frame 035939/0873 →
Assignment of Assignor's Interest
Jul 1, 2015
From: TALLEDO, JEFFERSON
To: STMICROELECTRONICS, INC.
Reel/Frame 035949/0336 →
Assignment of Assignor's Interest
Sep 23, 2015
From: TALLEDO, JEFFERSON
To: STMICROELECTRONICS, INC.
Reel/Frame 036638/0942 →
Assignment of Assignor's Interest
Sep 23, 2015
From: FONTANA, FULVIO
To: STMICROELECTRONICS S.R.L.
Reel/Frame 036638/0934 →
Assignment of Assignor's Interest
Dec 7, 2015
From: CADAG, ELA MIA; TALLEDO, JEFFERSON
To: STMICROELECTRONICS, INC.
Reel/Frame 037225/0541 →
Assignment of Assignor's Interest
Jan 11, 2016
From: DIMAYUGA, GODFREY; ARELLANO, FREDERICK; TABIERA, MICHAEL
To: STMICROELECTRONICS, INC.
Reel/Frame 037454/0882 →
Assignment of Assignor's Interest
Mar 15, 2016
From: RODRIGUEZ, RENNIER; ARELLANO, FREDERICK; AGUDON, AIZA MARIE
To: STMICROELECTRONICS, INC.
Reel/Frame 037988/0613 →
Assignment of Assignor's Interest
Jun 13, 2016
From: TALLEDO, JEFFERSON
To: STMICROELECTRONICS, INC.
Reel/Frame 038900/0495 →
Assignment of Assignor's Interest
Sep 30, 2016
From: TALLEDO, JEFFERSON
To: STMICROELECTRONICS, INC.
Reel/Frame 039910/0138 →
Assignment of Assignor's Interest
Jan 25, 2017
From: RODRIGUEZ, RENNIER; AGUDON, AIZA MARIE; TALLEDO, JEFFERSON
To: STMICROELECTRONICS, INC.
Reel/Frame 041084/0317 →
Assignment of Assignor's Interest
Nov 1, 2022
From: STMICROELECTRONICS S.R.L.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 061828/0243 →