Semiconductor device including conductive clip with flexible leads and related methods
An integrated circuit (IC) device may include a leadframe and an IC die having a first surface coupled to the lead frame and a second surface opposite the first surface. The IC device may further include a conductive clip including a first portion coupled to the second surface of the IC die, a second portion coupled to the first portion and extending laterally away from the IC die, and at least one flexible lead coupled to the second portion and looping back under the second portion toward the leadframe. Furthermore, a package may be over the leadframe, IC die, and conductive clip and have an opening therein exposing the at least one flexible lead.
1. A semiconductor device comprising:
a leadframe;
a semiconductor die having a first surface coupled to the leadframe, and a second surface opposite the first surface;
a conductive clip comprising:
a first portion coupled to the second surface of the semiconductor die,
a second portion coupled to the first portion and extending laterally away from the semiconductor die, and
a flexible lead coupled to the second portion and looping back under the second portion toward the leadframe; and
a package encapsulating the semiconductor die, and the conductive clip except for an opening in a bottom thereof exposing the flexible lead only at the bottom of the package, wherein the package has an inner portion inside the flexible lead extending to a lowermost surface of the flexible lead, and an outer portion outside the flexible lead also extending to the lowermost surface of the flexible lead.
2. The semiconductor device of claim 1 wherein the flexible lead comprises one of a plurality of spaced apart flexible leads coupled to the second portion and looping back under the second portion toward the leadframe.
3. The semiconductor device of claim 1 wherein the flexible lead has a thickness less than a thickness of the first and second portions of the conductive clip.
4. The semiconductor device of claim 1 wherein the flexible lead defines a gap with an adjacent area of the second portion of the conductive clip.
5. The semiconductor device of claim 1 wherein the second portion has a pair of opposing bends therein.
6. The semiconductor device of claim 1 wherein the leadframe has a bottom surface that is flush with a bottom surface of the flexible lead.
7. The semiconductor device of claim 1 further comprising a first solder layer coupling the first surface of the semiconductor die to the leadframe.
8. The semiconductor device of claim 1 further comprising a second solder layer coupling the second surface of the semiconductor die to the first portion of the conductive clip.
9. An electronic device comprising:
the semiconductor device of claim 1 ; and
a printed circuit board (PCB) electrically coupled to the flexible lead.
10. A method for making a semiconductor device comprising:
coupling a first surface of an semiconductor die to a leadframe, the semiconductor die also having a second surface opposite the first surface;
coupling a first portion of a conductive clip to the second surface of the semiconductor die so that a second portion of the conductive clip coupled to the first portion extends laterally away from the semiconductor die, the conductive clip also having a flexible lead coupled to the second portion and looping back under the second portion toward the leadframe;
forming a package over the leadframe, semiconductor die, and conductive clip so that the leadframe, semiconductor die, and conductive clip are not exposed outside the package; and
etching an opening in a bottom of the package exposing the flexible lead only at the bottom of the package.
11. The method of claim 10 wherein the flexible lead comprises a plurality of spaced apart flexible leads.
12. The method of claim 10 wherein the flexible lead has a thickness less than a thickness of the first and second portions of the conductive clip.
13. The method of claim 10 wherein the flexible lead defines a gap with an adjacent area of the second portion of the conductive clip.
14. The method of claim 10 wherein the second portion has a pair of opposing bends therein.
15. The method of claim 10 wherein the leadframe has a bottom surface that is flush with a bottom surface of the flexible lead.
16. The method of claim 10 wherein coupling the first surface of the semiconductor die to the leadframe comprises coupling the first surface of the semiconductor die to the leadframe with a first solder layer.
17. The method of claim 10 wherein coupling the second surface of the semiconductor die to the first portion of the conductive clip comprises coupling the second surface of the semiconductor die to the first portion of the conductive clip with a second solder layer.
18. The semiconductor device of claim 1 , wherein the first portion of the conductive clip is coupled to the semiconductor die without wire by having an overlapping region of the first portion that overlaps the conductive clip being soldered to the semiconductor die.
19. The semiconductor device of claim 18 , wherein the overlapping region is soldered to the semiconductor die with a solder layer applied between a lower surface of the overlapping region of the first portion of the conductive clip and an upper surface of the semiconductor die.