Integrated circuit device having exposed contact pads and leads supporting the integrated circuit die and method of forming the device
An integrated circuit (IC) device includes an IC die and encapsulation material surrounding the IC die. A first set of leads is coupled to the IC die and has first contact pads exposed on a bottom surface of the encapsulation material adjacent its periphery. A second set of leads is coupled to the IC die and has second contact pads exposed on the bottom surface of the encapsulation material adjacent its periphery. The second set of leads has internal ends extending laterally inwardly from respective ones of the second contact pads to define a die pad area supporting the IC die.
1. An integrated circuit (IC) device comprising:
an IC die;
encapsulation material surrounding said IC die;
a first set of leads, coupled to said IC die, and having first contact pads exposed on a bottom surface of said encapsulation material adjacent a periphery thereof; and
a second set of leads, coupled to said IC die, and having second contact pads exposed on the bottom surface of said encapsulation material adjacent the periphery thereof;
said second set of leads also having internal ends extending laterally inwardly from respective ones of said second contact pads to define a die pad area supporting said IC die thereon, wherein the bottom surface of the encapsulation material has four sides defining a rectangular shape and the second set of leads includes respective groups of leads having different lengths extending in parallel and inwardly from each of the four sides to define an X-shaped opening between corners of the rectangular shape.
2. The IC device of claim 1 wherein said first and second contact pads are arranged in an alternating pattern.
3. The IC device of claim 1 wherein said first and second contact pads are arranged in an offset pattern with said first contact pads being arranged closer to the periphery of the bottom surface of said encapsulation material than said second contact pads.
4. The IC device of claim 1 wherein said first set of leads have a same shape and size.
5. The IC device of claim 1 wherein each lead of said second set of leads comprises an encapsulated distal end extending laterally outwardly from a respective second contact pad.
6. The IC device of claim 1 further comprising:
a first set of bond wires coupling said IC die and said first set of leads; and
a second set of bond wires coupling said IC die and said second set of leads.
7. An integrated circuit (IC) device comprising:
an IC die;
encapsulation material surrounding said IC die;
a first set of leads, coupled to said IC die, and having first contact pads exposed on a bottom surface of said encapsulation material adjacent a periphery thereof, said first set of leads having a same shape and size; and
a second set of leads, coupled to said IC die, and having second contact pads exposed on the bottom surface of said encapsulation material adjacent the periphery thereof;
said second set of leads also having internal ends extending laterally inwardly from respective ones of said second contact pads to define a die pad area supporting said IC die thereon, each lead of said second set of leads comprising an encapsulated distal end extending laterally outwardly from a respective second contact pad, wherein the bottom surface of the encapsulation material has four sides defining a rectangular shape and the second set of leads includes respective groups of leads having different lengths extending in parallel and inwardly from each of the four sides to define an X-shaped opening between corners of the rectangular shape.
8. The IC device of claim 7 wherein said first and second contact pads are arranged in an alternating pattern.
9. The IC device of claim 7 wherein said first and second contact pads are arranged in an offset pattern with said first contact pads being arranged closer to the periphery of the bottom surface of said encapsulation material than said second contact pads.
10. The IC device of claim 7 further comprising:
a first set of bond wires coupling said IC die and said first set of leads; and
a second set of bond wires coupling said IC die and said second set of leads.
11. A method for making an integrated circuit (IC) device comprising:
coupling a first set of leads having first contact pads to an IC die;
coupling a second set of leads having second contact pads to the IC die, the second set of leads also having internal ends extending laterally inwardly from respective ones of the second contact pads to define a die pad area supporting the IC die thereon; and
surrounding the IC die with an encapsulation material so that the first and second contact pads are exposed on a bottom surface of the encapsulation material adjacent a periphery thereof, wherein the bottom surface of the encapsulation material has four sides defining a rectangular shape and the second set of leads includes respective groups of leads having different lengths extending in parallel and inwardly from each of the four sides to define an X-shaped opening between corners of the rectangular shape.
12. The method of claim 11 wherein the first and second contact pads are arranged in an alternating pattern.
13. The method of claim 11 wherein the first and second contact pads are arranged in an offset pattern with the first contact pads being arranged closer to the periphery of the bottom surface of the encapsulation material than the second contact pads.
14. The method of claim 11 wherein the first set of leads have a same shape and size.
15. The method of claim 11 wherein each lead of the second set of leads comprises an encapsulated distal end extending laterally outwardly from a respective second contact pad.