Patent Assignment
Reel/Frame 036654/0587
Assignment of Assignor's Interest
Recorded: 2015-09-25
Pages: 2
Assignor
YANG, SEUNG TAEK
Executed: 2015-08-03
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate Including a Dam for Semiconductor Package, Semiconductor Package Using the Same, and Manufacturing Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.