Patent Assignment
Reel/Frame 036671/0939
Assignment of Assignor's Interest
Recorded: 2015-09-28
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2015-09-23
CHEN, CHIH-HUA
Executed: 2015-09-11
TSAI, HAO-YI
Executed: 2015-09-11
CHEN, YU-FENG
Executed: 2015-09-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Package Structures and Method of Forming the Same