Patent Assignment
Reel/Frame 036705/0014
Assignment of Assignor's Interest
Recorded: 2015-10-01
Pages: 8
Assignors
CO, REYNALDO
Executed: 2011-06-10
LEAL, JEFFREY S.
Executed: 2011-06-08
PANGRLE, SUZETTE K.
Executed: 2011-06-08
MCGRATH, SCOTT
Executed: 2011-06-08
MELCHER, DEANN EILEEN
Executed: 2011-06-09
BARRIE, KEITH L.
Executed: 2011-06-08
VILLAVICENCIO, GRANT
Executed: 2011-06-08
DEL ROSARIO, ELMER M.
Executed: 2011-06-08
BRAY, JOHN R.
Executed: 2011-06-08
Assignee
VERTICAL CIRCUITS, INC.
10 VICTOR SQUARE, SCOTTS VALLEY, CALIFORNIA, 95066
Covered Property
(1)
Electrical Connector Between Die Pad and Z-Interconnect for Stacked Die Assemblies
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 5, 2015
From: VERTICAL CIRCUITS, INC.
To: VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Reel/Frame 036726/0409 →
Assignment of Assignor's Interest
Oct 6, 2015
From: VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
To: INVENSAS CORPORATION
Reel/Frame 036736/0684 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Change of Name
Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073941/0814 →
Change of Name
Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0745 →