Patent Assignment
Reel/Frame 036708/0106
Assignment of Assignor's Interest
Recorded: 2015-10-01
Pages: 4
Assignors
AKIBA, HIDEKI
Executed: 2015-09-10
NAKAMURA, TOMOAKI
Executed: 2015-09-11
SHIOBARA, TOSHIO
Executed: 2015-09-10
YAMAGUCHI, SHINSUKE
Executed: 2015-09-11
Assignee
SHIN-ETSU CHEMICAL CO., LTD.
6-1, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Electromagnetic Wave Shielding Support Base-Attached Encapsulant, Encapsulated Substrate Having Semicondutor Devices Mounted Thereon, Encapsulated Wafer Having Semiconductor Devices Formed Thereon, and Semiconductor Apparatus