Patent Assignment
Reel/Frame 036709/0344
Assignment of Assignor's Interest
Recorded: 2015-10-02
Pages: 3
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof