Patent Assignment
Reel/Frame 036713/0875
Assignment of Assignor's Interest
Recorded: 2015-10-02
Pages: 7
Assignors
CHOI, JU-IL
Executed: 2015-08-04
FUJISAKI, ATSUSHI
Executed: 2015-08-04
PARK, BYUNG-LYUL
Executed: 2015-08-04
PARK, JI-SOON
Executed: 2015-08-04
JANG, JOO-HEE
Executed: 2015-08-04
JIN, JEONG-GI
Executed: 2015-08-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Devices Having Through-Silicon Vias and Methods of Manufacturing Such Devices