Patent Assignment
Reel/Frame 036718/0022
Assignment of Assignor's Interest
Recorded: 2015-10-02
Pages: 3
Assignors
YOSHIKAWA, SHUNSAKU
Executed: 2015-08-20
HIRAI, NAOKO
Executed: 2015-08-20
TACHIBANA, KEN
Executed: 2015-08-20
TACHIBANA, YOSHIE
Executed: 2015-08-20
Assignee
SENJU METAL INDUSTRY CO., LTD.
23, SENJU-HASHIDO-CHO, ADACHI-KU, TOKYO, 120-8555, JAPAN
Covered Property
(1)
Lead-Free Solder Alloy and in-Vehicle Electronic Circuit