IP Library Assignment 036754/0427
Patent Assignment
Reel/Frame 036754/0427

Assignment of Assignor's Interest

Recorded: 2015-10-08 Pages: 3
Assignor
RAMVALL, PETER
Executed: 2015-09-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN ROAD 6,, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Method for Forming Aluminum-Containing Dielectric Layer
Application: 14/878,016 →
Publication: US 2017/0103883