Patent Assignment
Reel/Frame 036767/0380
Assignment of Assignor's Interest
Recorded: 2015-10-09
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Bump Structural Designs to Minimize Package Defects
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.