Patent Assignment
Reel/Frame 036769/0219
Assignment of Assignor's Interest
Recorded: 2015-10-09
Pages: 10
Assignee
SK HYNIX, INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, GYEONGGI-DO, ICHEON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing an Electronic Device Including a Semiconductor Memory Having a Metal Electrode and a Metal Compound Layer Surrounding Sidewall of the Metal Electrode