Patent Assignment
Reel/Frame 036788/0483
Assignment of Assignor's Interest
Recorded: 2015-10-14
Pages: 3
Assignee
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
18 ZHANGJIANG ROAD, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
Covered Property
(1)
Fabrication Method of Interconnect Structure