Patent Assignment
Reel/Frame 036790/0690
Assignment of Assignor's Interest
Recorded: 2015-10-14
Pages: 2
Assignor
HUANG, YU-LUNG
Executed: 2015-10-02
Assignee
XINTEC INC.
9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK, JHONGLI DIST., TAOYUAN CITY, 32062, TAIWAN
Covered Property
(1)
Chip Package and Method for Forming the Same