Patent Assignment
Reel/Frame 036804/0632
Assignment of Assignor's Interest
Recorded: 2015-10-15
Pages: 4
Assignors
HSIEH, CHENG-CHIEH
Executed: 2015-09-30
WU, CHI-HSI
Executed: 2015-09-30
JENG, SHIN-PUU
Executed: 2015-10-01
HUNG, WENSEN
Executed: 2015-10-01
CHEN, TSUNG-YU
Executed: 2015-09-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Cooling Devices, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices