Patent Assignment
Reel/Frame 036819/0096
Assignment of Assignor's Interest
Recorded: 2015-10-19
Pages: 4
Assignor
KIM, SUNG WOOK
Executed: 2015-10-16
Assignee
HANWHA TECHWIN CO., LTD.
1204, CHANGWON-DAERO, SEONGSAN-GU, GYEONGSANGNAM-DO, CHANGWON-SI, KOREA, REPUBLIC OF
Covered Property
(1)
Method and Apparatus for Thinning Wafer
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.