Patent Assignment
Reel/Frame 036831/0220
Assignment of Assignor's Interest
Recorded: 2015-10-20
Pages: 2
Assignor
LIN, YAOJIAN
Executed: 2015-10-16
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, TECHPOINT #04-08/09, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Fabricating 3D Package With Short Cycle Time and High Yield