Patent Assignment
Reel/Frame 036842/0558
Assignment of Assignor's Interest
Recorded: 2015-10-21
Pages: 3
Assignors
CHENG, TAO
Executed: 2015-10-16
HSU, WEN-SUNG
Executed: 2015-10-16
LIN, SHIH-CHIN
Executed: 2015-10-16
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300, TAIWAN
Covered Property
(1)
Composite Solder Ball, Semiconductor Package Using the Same, Semiconductor Device Using the Same and Manufacturing Method Thereof