Patent Assignment
Reel/Frame 036844/0634
Assignment of Assignor's Interest
Recorded: 2015-10-21
Pages: 2
Assignor
SEYAMA, KOHEI
Executed: 2015-09-28
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Flip Chip Bonder and Flip Chip Bonding Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.