IP Library Assignment 036904/0474
Patent Assignment
Reel/Frame 036904/0474

Assignment of Assignor's Interest

Recorded: 2015-10-28 Pages: 3
Assignors
YAMAGUCHI, HIROYUKI
Executed: 2015-10-14
NAKAYAMA, HAJIME
Executed: 2015-10-14
OGINO, HARUO
Executed: 2015-10-14
KURIHARA, SEIICHI
Executed: 2015-10-14
Assignee
HITACHI CHEMICAL COMPANY, LTD
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Multilayer Wiring Plate and Method for Fabricating Same
Application: 14/762,440 →
Publication: US 2015/0357699
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 9, 2022
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 059355/0743 →
Demerger Jun 14, 2022
From: SHOWA DENKO MATERIALS CO., LTD.
To: LINCSTECH CO., LTD.
Reel/Frame 060281/0643 →