IP Library › Assignment 036914/0844
Patent Assignment
Reel/Frame 036914/0844

Assignment of Assignor's Interest

Recorded: 2015-10-29 Pages: 3
Assignor
SHI, LEI
Executed: 2015-10-28
Assignee
NANTONG FUJITSU MICROELECTRONICS CO., LTD.
NO. 288, CHONGCHUAN ROAD, NANTONG, 226006, CHINA
Covered Property (1)
Flip-Chip on Leadframe Semiconductor Packaging Structure and Fabrication Method Thereof
Patent: 9,502,337 →
Application: 14/926,649 →
Publication: US 2016/0126166
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jan 17, 2017
From: NANTONG FUJITSU MICROELECTRONICS CO., LTD.
To: TONGFU MICROELECTRONICS CO., LTD.
Reel/Frame 041381/0374 →