Patent Assignment
Reel/Frame 036915/0675
Assignment of Assignor's Interest
Recorded: 2015-10-29
Pages: 2
Assignor
SEYAMA, KOHEI
Executed: 2015-07-15
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Flip Chip Bonder and Method of Correcting Flatness and Deformation Amount of Bonding Stage
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.