Patent Assignment
Reel/Frame 036917/0713
Assignment of Assignor's Interest
Recorded: 2015-10-29
Pages: 2
Assignors
YEE, KUO-CHUNG
Executed: 2015-10-15
YU, CHEN-HUA
Executed: 2015-10-15
WANG, TSUNG-DING
Executed: 2015-10-15
LEE, CHIEN-HSUN
Executed: 2015-10-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6 SCIENCE-BASED, INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Methods of Forming Multi-Die Package Structures Including Redistribution Layers
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.