Patent Assignment
Reel/Frame 036926/0133
Assignment of Assignor's Interest
Recorded: 2015-10-30
Pages: 4
Assignors
TSAI, BOR-TZONG
Executed: 2015-10-22
CHOU, CHUN-HAO
Executed: 2015-10-22
TSAI, TSUNG-HAN
Executed: 2015-10-22
LEE, KUO-CHENG
Executed: 2015-10-22
HSU, YUNG-LUNG
Executed: 2015-10-22
CHENG, YUN-WEI
Executed: 2015-10-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Complementary Metal Grid and Deep Trench Isolation in Cis Application