Patent Assignment
Reel/Frame 036969/0604
Assignment of Assignor's Interest
Recorded: 2015-11-05
Pages: 2
Assignor
XUE, YAN XUN
Executed: 2015-11-03
Assignee
ALPHA AND OMEGA SEMICONDUCTOR INCORPORATED
475 OAKMEAD PKWY, SUNNYVALE, CALIFORNIA, 94085
Covered Property
(1)
Method and Structure for Wafer Level Packaging with Large Contact Area