Patent Assignment
Reel/Frame 036979/0205
Assignment of Assignor's Interest
Recorded: 2015-11-06
Pages: 7
Assignors
HINKLE, JONATHAN RANDALL
Executed: 2015-11-02
HONDA, YASUSHI
Executed: 2015-11-04
KONAKA, SHIRO
Executed: 2015-11-04
MATTESON, JASON A.
Executed: 2015-11-02
ODAOHHARA, SHIGEFUMI
Executed: 2015-11-04
Assignee
LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
151 LORONG CHUAN #02-01, NEW TECH PARK, SINGAPORE, 556741, SINGAPORE
Covered Property
(1)
Card Connector System with Heat Dissipation and Electromagnetic Interference (Emi) Shielding
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 9, 2019
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE LTD.
To: LENOVO GLOBAL TECHNOLOGIES INTERNATIONAL LTD
Reel/Frame 050308/0781 →
Assignment of Assignor's Interest
Jan 10, 2025
From: LENOVO GLOBAL TECHNOLOGIES INTERNATIONAL LIMITED
To: LENOVO GLOBAL TECHNOLOGIES SWITZERLAND INTERNATIONAL GMBH
Reel/Frame 069869/0614 →