IP Library Granted Patent US 9,787,033
Granted Patent B2
US 9,787,033 · App. 14/934,580 · Granted Oct 10, 2017

Card connector system with heat dissipation and electromagnetic interference (EMI) shielding

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Quick Facts
Patent No.
US 9,787,033
App. No.
14/934,580
Granted
Oct 10, 2017
Kind
B2
Abstract

A system according to one embodiment includes opposing slide plates, and opposing guide blocks configured to receive the slide plates therebetween and push the slide plates together during a relative motion between the slide plates and the guide blocks. A system according to another embodiment includes opposing slide plates and a thermal interface material coupled to opposing inner faces of the slide plate. Opposing guide blocks are configured to receive the slide plates therebetween and push the slide plates together during a relative motion between the slide plates and the guide blocks. An interface connector is coupled to at least one of the guide blocks and the slide plates, the interface connector having electrical connectors on opposite ends thereof.

Claims (29)

1. A system, comprising:

opposing slide plates; and

opposing guide blocks, each guide block being configured to receive both of the slide plates therebetween and push the slide plates together during a relative motion between the slide plates and the guide blocks.

2. The system as recited in claim 1 , wherein the guide blocks each have a track for receiving mating portions of the slide plates, each track becoming narrower from a first end towards a second end of the associated guide block.

3. The system as recited in claim 2 , wherein the mating portions each have a generally trapezoidal profile.

4. The system as recited in claim 2 , wherein the mating portions of a first of the slide plates extend towards mating portions of a second of the slide plates, thereby defining a cavity between the slide plates.

5. The system as recited in claim 2 , comprising a thermal interface material coupled to opposing inner faces of the slide plates.

6. The system as recited in claim 1 , wherein the guide blocks each have a generally trapezoidal cross sectional profile, each of the guide blocks becoming thicker from a first end towards a second end of the associated guide block.

7. The system as recited in claim 6 , wherein the slide plates each have a generally trapezoidal cross sectional profile, each of the slide plates becoming thinner from a first end towards a second end of the associated slide plate.

8. The system as recited in claim 6 , wherein the guide blocks engage largest outer surfaces of the slide plates.

9. The system as recited in claim 6 , comprising a thermal interface material coupled to opposing inner faces of the slide plates.

10. The system as recited in claim 1 , comprising fins extending from at least one of the slide plates.

11. The system as recited in claim 1 , comprising an interface connector coupled to at least one element selected from a group consisting of: one or more of the guide blocks and one or more of the slide plates, the interface connector having electrical connectors on opposite ends thereof.

12. The system as recited in claim 1 , wherein the slide plates are constructed of an electromagnetic interference suppressing material.

13. The system as recited in claim 1 , wherein the guide blocks are constructed of an electromagnetic interference suppressing material.

14. A system, comprising

opposing slide plates;

opposing guide blocks configured to receive the slide plates therebetween and push the slide plates together during a relative motion between the slide plates and the guide blocks; and

fins extending from at least one of the guide blocks.

15. A system, comprising:

opposing slide plates;

a thermal interface material coupled to opposing inner faces of the slide plates;

opposing guide blocks for receiving the slide plates therebetween and pushing the slide plates together during a relative motion between the slide plates and the guide blocks; and

an interface connector coupled to at least one element selected from a group consisting of: one or more of the guide blocks and one or more of the slide plates, the interface connector having electrical connectors on opposite ends thereof.

16. The system as recited in claim 15 , wherein the guide blocks each have a track for receiving mating portions of the slide plates, each track becoming narrower from a first end towards a second end of the associated guide block for changing a distance between the slide plates during the relative motion between the slide plates and the guide blocks.

17. The system as recited in claim 16 , wherein the mating portions each have a generally trapezoidal profile.

18. The system as recited in claim 15 , wherein the guide blocks each have a generally trapezoidal cross sectional profile.

19. The system as recited in claim 15 , comprising fins extending from a component selected from a group consisting of: at least one of the slide plates and at least one of the guide blocks.

20. The system as recited in claim 15 , wherein the thermal interface material extends along each of the opposing inner faces between the opposing inner faces.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 10, 2025
From: LENOVO GLOBAL TECHNOLOGIES INTERNATIONAL LIMITED
To: LENOVO GLOBAL TECHNOLOGIES SWITZERLAND INTERNATIONAL GMBH
Reel/Frame 069869/0614 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 9, 2019
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE LTD.
To: LENOVO GLOBAL TECHNOLOGIES INTERNATIONAL LTD
Reel/Frame 050308/0781 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 6, 2015
From: HINKLE, JONATHAN RANDALL; HONDA, YASUSHI; KONAKA, SHIRO; MATTESON, JASON A.; ODAOHHARA, SHIGEFUMI
To: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
Reel/Frame 036979/0205 →