Patent Assignment
Reel/Frame 036985/0791
Assignment of Assignor's Interest
Recorded: 2015-11-09
Pages: 3
Assignor
HEINRICH, ALEXANDER
Executed: 2015-09-28
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Method of Forming a Chip Assembly with a Die Attach Liquid