Patent Assignment
Reel/Frame 036996/0517
Assignment of Assignor's Interest
Recorded: 2015-11-09
Pages: 4
Assignors
JEONG, DONG JIN
Executed: 2015-10-24
LEE, KYUNG SEOP
Executed: 2015-10-24
CHOI, YONG UN
Executed: 2015-10-24
SON, KYUNG MIN
Executed: 2015-10-24
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Component Having Lead Part Including Regions Having Different Thicknesses and Method of Manufacturing the Same