Patent Assignment
Reel/Frame 036999/0456
Assignment of Assignor's Interest
Recorded: 2015-11-10
Pages: 3
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Bonding Substrates Using Solder Surface Tension During Solder Reflow for Three Dimensional Self-Alignment of Substrates
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.