Patent Assignment
Reel/Frame 037005/0661
Assignment of Assignor's Interest
Recorded: 2015-11-10
Pages: 4
Assignors
LIANG, SHIH-WEI
Executed: 2015-10-23
SU, BOR-RUNG
Executed: 2015-10-26
HUANG, CHANG-PIN
Executed: 2015-10-23
CHIU, CHIEN-CHIA
Executed: 2015-10-27
TU, HSIEN-MING
Executed: 2015-10-23
LIN, CHUN-HUNG
Executed: 2015-10-26
LAI, YU-CHIA
Executed: 2015-10-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Shadow Pad For Post-Passivation Interconnect Structures