Patent Assignment
Reel/Frame 037021/0680
Assignment of Assignor's Interest
Recorded: 2015-11-12
Pages: 5
Assignors
YANG, SHIN-YI
Executed: 2015-09-25
LEE, MING-HAN
Executed: 2015-09-25
SHUE, SHAU-LIN
Executed: 2015-09-25
KUO, TZ-JUN
Executed: 2015-09-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN ROAD 6,, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Method of Forming Metal Interconnection