Patent Assignment
Reel/Frame 037022/0340
Assignment of Assignor's Interest
Recorded: 2015-11-12
Pages: 3
Assignors
LU, CHIH WEI
Executed: 2015-09-02
LEE, CHUNG-JU
Executed: 2015-09-04
BAO, TIEN-I
Executed: 2015-09-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN ROAD 6,, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Structure and Method for Interconnection