Patent Assignment
Reel/Frame 037024/0407
Assignment of Assignor's Interest
Recorded: 2015-11-12
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Package and Method of Forming the Same