Patent Assignment
Reel/Frame 037035/0218
Assignment of Assignor's Interest
Recorded: 2015-11-13
Pages: 8
Assignors
JANG, JOO-HEE
Executed: 2015-10-14
KANG, PIL-KYU
Executed: 2015-10-14
KIM, SEOK-HO
Executed: 2015-10-14
KIM, TAE-YEONG
Executed: 2015-10-14
KIM, HYO-JU
Executed: 2015-10-14
PARK, BYUNG-LYUL
Executed: 2015-10-14
PARK, JUM-YONG
Executed: 2014-10-14
AN, JIN-HO
Executed: 2014-10-14
LEE, KYU-HA
Executed: 2014-10-14
HONG, YI-KOAN
Executed: 2014-10-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Fabricating Multi-Substrate Semiconductor Devices