Patent Assignment
Reel/Frame 037037/0625
Assignment of Assignor's Interest
Recorded: 2015-11-13
Pages: 2
Assignors
PAN, HSIN-YU
Executed: 2015-10-29
PU, HAN-PING
Executed: 2015-10-29
TSAO, PEI-HAW
Executed: 2015-10-30
HSU, YU-CHEN
Executed: 2015-10-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6 SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Seal Rings Structures in Semiconductor Device Interconnect Layers and Methods of Forming the Same